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January 2006

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Wed, 18 Jan 2006 11:30:33 -0500
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Rich,

I have a lot of thoughts but I think I could narrow down the thoughts if
you could take a photograph and have Steve post it on his web page 


Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Wednesday, January 18, 2006 11:20 AM
To: [log in to unmask]
Subject: [TN] ImAg Flaking away

Has anyone had any issues with ImAg breaking away from the perimeter of
a PTH?  We seem to be seeing this in a tin/lead selective soldering
operation after the board has already seen 2 previous reflows.

 

Any thoughts?  

 

Rich K / KEDS

  


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