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Subject:	Re: ImAg Flaking away
From:	Richard Kraszewski <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:	Wed, 18 Jan 2006 11:24:12 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (59 lines)

The latter, flaking away from the outside perimeter of the hole. 

Rich K / KEDS
260.925.8719
 

-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]] 
Sent: Wednesday, January 18, 2006 11:23 AM
To: TechNet E-Mail Forum; Richard Kraszewski
Subject: RE: [TN] ImAg Flaking away

Flaking away from the perimeter of the hole (knee) or from the perimeter
of the pad around the hole? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Wednesday, January 18, 2006 10:20 AM
To: [log in to unmask]
Subject: [TN] ImAg Flaking away

Has anyone had any issues with ImAg breaking away from the perimeter of
a PTH?  We seem to be seeing this in a tin/lead selective soldering
operation after the board has already seen 2 previous reflows.

 

Any thoughts?  

 

Rich K / KEDS

  


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