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Date: | Wed, 4 Jan 2006 08:05:02 -0600 |
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Mornin' all you Technetters!
I've just posted some pictures that I was asked to post for discussion.
Go to:
http://stevezeva.homestead.com/files/lamvoids.jpg
http://stevezeva.homestead.com/files/lamvoids2.jpg
Eddie Rocha wanted some suggestions to his problem;
"I'm getting "LAM VOIDS" on a 16 layer board that we build. The board is
.140" thick and has 2 oz copper
on layers 2, 8, 9, and 15. Any ideas on what might be causing these "LAM
VOIDS". The "lam voids" are about
.004" x .010" in size and x-sections show them between different layers
such as the surface of layers 2, 6, and
11. I just began looking into this issue so I'll appreciate any ideas."
and these pictures from Wee Mei who asks;
"Would appreciate you can download the following defects on solder mask
for discussion on your site. In your opinion,
what are they? This time, it is different from the previous defect
though they are found in the same location again."
http://stevezeva.homestead.com/files/SM1.JPG
http://stevezeva.homestead.com/files/SM2.JPG
http://stevezeva.homestead.com/files/SM3.JPG
Kind regards,
Stephen Gregory
Senior Process Engineer
LaBarge Incorporated
Tulsa, OK 74146
(918) 459-2285
(918) 459-2350 FAX
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