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January 2006

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 16 Jan 2006 15:24:23 -0600
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Ivanoe,
Read "Soldering for Electronics" by Klein-Wassink. All of the
dissolution rates are in there at given temperatures. Excellent book,
and I refer to it almost on a weekly basis. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ivanoe Pedruzzi
Sent: Monday, January 16, 2006 4:38 AM
To: [log in to unmask]
Subject: [TN] Dissolution rates and solder paste selection

Back on dissolution metals in molten solder, I remember reading on an
e-mail  the following dissolution rates:
Dissolution rates

Au = 117.9 u"/sec.

Ag = 43.6u"/sec.

Cu = 4.1 u"/sec.

Pd = 1.4 u"/sec.

Ni = 0.05u"/sec.

Pt = 0.01 u"/sec.

  At which temperature of the molten solder these dissolution rates are
applicable?

If I use those numbers to set up the TIME ABOVE LIQUID temperature
profile in a reflow oven, I'm not doing anything but the right thing, am
I ?

I also remember reading something about flux in the solder paste that
should be able to withstand that change (either longer time, or higher
temp, or both).

Upon your experience, is that practical? I don't remember any solder
paste representative talking about "...this paste for this plating, that
paste for that plating...".  Do you?



Thanks, Ivan



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