Hi Ivan! Metal dissolution rates are temperature specific - one of the most
often quotes sources is:
W. Bader, "Dissolution of Au, Ag, Pd, Pt, Cu and NI in a molten tin lead
solder", Welding Journal 48, 1969, pp. 551-557
Also this paper has the dissolution rate of copper in a variety of solder
alloys:
W. Bader, " Lead alloys for high temperature soldering of magnet wire",
Welding Journal 54, 1975, pp. 370-375.
Hey John Barnes - any other sources you can add?
Dave Hillman
Rockwell Collins
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Ivanoe Pedruzzi
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01/16/2006 04:38 [TN] Dissolution rates and solder
AM paste selection
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Ivanoe Pedruzzi
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Back on dissolution metals in molten solder, I remember reading on an
e-mail the following dissolution rates:
Dissolution rates
Au = 117.9 u"/sec.
Ag = 43.6u"/sec.
Cu = 4.1 u"/sec.
Pd = 1.4 u"/sec.
Ni = 0.05u"/sec.
Pt = 0.01 u"/sec.
At which temperature of the molten solder these dissolution rates
are applicable?
If I use those numbers to set up the TIME ABOVE LIQUID temperature
profile in a reflow oven, I'm not doing anything but the right thing,
am I ?
I also remember reading something about flux in the solder paste that
should be able to withstand that change (either longer time, or
higher temp, or both).
Upon your experience, is that practical? I don't remember any solder
paste representative talking about "...this paste for this plating,
that paste for that plating...". Do you?
Thanks, Ivan
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