Hi Victor,
I have been working with laser drilled and controlled-depth drilled blind
vias since 1982, when we first started to design them into our IC
substrates and then into pc boards for computers, instruments and PC's.
Later we figured out how to use them to reduce the layer count on
high-layer-count boards. and for high-frequency signal-integrity sensitive
circuits.
The IPC/JPCA-2315 HDI Design Guide is a good place to start, or you can go
to the HDI Design Std, IPC-2226, the HDI Mat'l Std, IPC/JPCA-4104 and the
HDI Qual and Perf Spec, IPC-6016.
For more information, The PC Handbook by Coombs 5th Edition has Chapters
11, 18, 21, 22, 23, 25 & 40 on HDI blind via technology.
Happy Holden
Westwood Associates
"Victor G. Hernandez" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
01/16/2006 09:17 AM
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[TN] PWB Buried/Blind Via Technology
Fellow TechNetters:
Can some one share their experience with PWB Blind/Buried Vias
interconnection?
Is there any Industry Standards an/or Guidelines that should be
followed?
Victor,
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