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January 2006

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Mon, 16 Jan 2006 12:49:24 -0500
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text/plain
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Ivan,

The "Dissolution of Au, Ag, Pd, Pt, Cu and Ni in a Molten Tin-Lead
Solder" came from Wally G. Bader's article of the same title published
in the December 1969 Welding Journal.


Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ivanoe Pedruzzi
Sent: Monday, January 16, 2006 5:38 AM
To: [log in to unmask]
Subject: [TN] Dissolution rates and solder paste selection

Back on dissolution metals in molten solder, I remember reading on an
e-mail  the following dissolution rates:
Dissolution rates

Au = 117.9 u"/sec.

Ag = 43.6u"/sec.

Cu = 4.1 u"/sec.

Pd = 1.4 u"/sec.

Ni = 0.05u"/sec.

Pt = 0.01 u"/sec.

  At which temperature of the molten solder these dissolution rates are
applicable?

If I use those numbers to set up the TIME ABOVE LIQUID temperature
profile in a reflow oven, I'm not doing anything but the right thing, am
I ?

I also remember reading something about flux in the solder paste that
should be able to withstand that change (either longer time, or higher
temp, or both).

Upon your experience, is that practical? I don't remember any solder
paste representative talking about "...this paste for this plating, that
paste for that plating...".  Do you?



Thanks, Ivan



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