Back on dissolution metals in molten solder, I remember reading on an
e-mail  the following dissolution rates:
Dissolution rates

Au = 117.9 u"/sec.

Ag = 43.6u"/sec.

Cu = 4.1 u"/sec.

Pd = 1.4 u"/sec.

Ni = 0.05u"/sec.

Pt = 0.01 u"/sec.

  At which temperature of the molten solder these dissolution rates
are applicable?

If I use those numbers to set up the TIME ABOVE LIQUID temperature
profile in a reflow oven, I'm not doing anything but the right thing,
am I ?

I also remember reading something about flux in the solder paste that
should be able to withstand that change (either longer time, or
higher temp, or both).

Upon your experience, is that practical? I don't remember any solder
paste representative talking about "...this paste for this plating,
that paste for that plating...".  Do you?



Thanks, Ivan



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