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January 2006

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Subject:
From:
Ted Tontis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ted Tontis <[log in to unmask]>
Date:
Tue, 31 Jan 2006 11:16:53 -0600
Content-Type:
text/plain
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text/plain (67 lines)
Mike,
        Put coupons on the assembly rail, you can destroy them and get
an exact representation of what is on the PCB. 
        Cross sectioning is the best way to get the measurements you are
looking for. 

Regards,

Ted

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Michael McMonagle
Sent: Tuesday, January 31, 2006 10:46 AM
To: [log in to unmask]
Subject: [TN] Au & Photoresist Thickness Measurement

I have been thrown an interesting question that I cannot answer, so I'll
toss it out here for y'all to ponder. We are looking for a way to
measure
the thickness of gold and photoresist on a ceramic substrate. The test
needs
to be non-destructive for use as an in-process production test,
measuring
gold in the range of 5 microns covered with photoresist in the range of
3-6
microns. Any inputs greatly appreciated, thanks..

 

Mike McMonagle
Quality Manager
OYO Geospace
7007 Pinemont Drive
Houston, TX 77040
Ph 713-986-8650
Fx 713-986-8725

 


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