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Date: | Wed, 18 Jan 2006 09:03:19 -0800 |
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Richard:
Having not seen it, but having an idea... I would bet that the problem is caused by soldermask "development issues"... I would bet that there remain soldermask residues on the edges, which get plated over, but which cause the plating to be non-adherent.
Does this fit the available data?
Rudy Sedlak
Richard Kraszewski <[log in to unmask]> wrote: Has anyone had any issues with ImAg breaking away from the perimeter of
a PTH? We seem to be seeing this in a tin/lead selective soldering
operation after the board has already seen 2 previous reflows.
Any thoughts?
Rich K / KEDS
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