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January 2006

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Subject:
Re-balling LF BGAs with SnPb
From:
Gregg Klawson <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 5 Jan 2006 08:37:18 -0700
Content-Type:
TEXT/plain
Parts/Attachments:
TEXT/plain (20 lines) 
I am wondering if anyone out there is re-balling lead-free BGA's with
tin-lead and would be willing share their experiences.   I see a few
vendors offer this service.  I don't doubt that it's feasible to do
this but I wonder how reliable the BGA interconnects would be after the
re-balling process.    Can re-balling be considered an interim solution
to the problem of soldering a LF BGA in a tin-lead process?

Thanks

-- Gregg Klawson
email: lists_at_klawson.org

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