In reading some forums related to land pattern development and in particular IPC-7351A, I've seen references to having to develop unique land patterns for lead free circuit boards based on a particular device manufacturer's package size.
Is anyone contemplating this as a viable strategy for lead-free PWB layouts?
Thanks for your inputs.
Rick Thompson
Sr. SMT Process Engineer
CTS Electronics Manufacturing Solutions
+1 (805) 532-2800 x-193
[log in to unmask]
www.ctscorp.com
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