Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Fri, 27 Jan 2006 15:32:15 -0500 |
Content-Type: | text/plain |
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Carol,
the readings of the XRF machines are very dependent on how you define the application and whether you do or don't do a calibration using pure elements. It seems that you can also improve reading accuracy by having standards of thicknesses close to the layers you analyze.
I would suggest getting the manufacturer of your machine involved.
Good luck,
Ioan
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of Carol Spiers
> Sent: Friday, January 27, 2006 1:20 PM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: [LF]
>
> I have just had an analysis completed on a first batch run of leadfree
> boards. Results indicate we have uniform contamination of 0.14-0.19
> layer of lead across the board. The testing and measurements were
> obtained using xray flouresence and indicate the lead is on the top
> layer of the melded solder. We confirmed that all parts were documented
> as being Lead Free (but not tested by us for compliance). Boards were
> double sided silver immersion smt and thru hole combinations. Solder
> paste used was SAC, wave solder bar used was SAC. The wave solder
> machine is brand new (never used in a leaded process). SMT oven is used
> for both leaded and unleaded processes.
> Because the contamination appears to be uniformly spread across the
> board I tend to think this isn't a problem related to a couple of
> components not actually being lead free and contiminating the huge pot
> of solder in the wave. One suggestion was that there might have been a
> thin layer of lead over top of the silver immersion on the bare boards.
>
> Is there anyone out there that would care to offer some suggestions as
> to where we should focus our investigation or if any alternative testing
> should be used.
> So far we are going to:
> 1) do comparison testing of two batches of bare boards of the same
> product coming from different suppliers and undergoing identical
> processing.
> 2) have a sample of the wave solder evaluated for contaminates and to
> establish the bench for future sample evaluations.
>
> Once again, your input and help will be much appreciated.
>
> Carol
> C. M. Spiers
> Director of Operations
> Interalia Inc.
>
>
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