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January 2006

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Subject:
Re: Attention CID Designers
From:
"Alcorn, Brent" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 17 Jan 2006 16:18:00 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (116 lines) 
Ted, good point.  We had to go to a high-temp version of plastic used on
the connectors.

Brent


-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Ted
Tontis
Sent: Tuesday, January 17, 2006 4:16 PM
To: [log in to unmask]
Subject: Re: [DC] Attention CID Designers

You will also have to verify that the TH component can survive the
reflow oven without damage.


Ted

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Cosentino, Tony
Sent: Tuesday, January 17, 2006 3:10 PM
To: [log in to unmask]
Subject: Re: [DC] Attention CID Designers

Adam,
More than likely you will need to use paste-in-hole technology. You
should contact your assembly house to see if they have specific
guidelines to follow when using paste-in-hole. I know the CM I use does.
Thanks
Tony Cosentino
Tekelec - PCB Design Engineer
919-460-3656 work
[log in to unmask]

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Adam
Smith
Sent: Tuesday, January 17, 2006 4:03 PM
To: [log in to unmask]
Subject: Re: [DC] Attention CID Designers

Hi,

I am working on a design where my thru hole components will need to be
placed during the Re-flow process. Does anyone have any experience with
this? Any Hints?

Adam Smith, CID
IR Halifax
7020 Mumford Rd
Halifax NS B3L 4S9
902.431.1644 x262



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