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January 2006

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Subject:
From:
"Gary M. Koven" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 10 Jan 2006 16:30:34 -0500
Content-Type:
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text/plain (81 lines)
Eric,

Try IPC-2222, Page 20, Table 9.3 “Plated-Through Hole Diameter to Lead
Diameter Relationships"

Best Regards,

----------------------------
Gary M. Koven, C.I.D.
Dynazign, Inc.
Charlotte, NC, USA
Veteran of the Marsh School



-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Eric
Bonatti
Sent: Tuesday, January 10, 2006 4:12 PM
To: [log in to unmask]
Subject: [DC] through hole component hole question

Hi all,
I have a question:

One of our clients has designed the circuit, and specified a component
through hole (finished) of 0.032" for a round pin size of 0.018" dia.  This
is for a flex approximately 0.011" thick.  This makes the aspect ratio of
almost 1:3 (instead of a common aspect ratio for a rigid board of say 6:1
for example).

This is a press-fit pin in another assembly that is being soldered to the
flex later.  The pin manufacturer recommends a size for the press-fit side,
but not for the solder tail side.

We are trying to explain to the customer that a 0.032" finished hole is too
wide to solder a 0.018" mil pin, but they are not very receptive to our
suggestions and are wondering what the problem is.  Keep in mind that the
original size they spec'ed was 0.047" !!  They reduced to 0.032", but are
now wondering what is wrong with us. 

Is there a IPC standard that defines the best design practice of a component
through hole size for a specific pin size, maybe a chart or a formula?  I
looked in IPC-2221 and could not find this.  I would like to show them a
clear recommendation from IPC in Black&White.

Thank you all in advance for any help.

Eric Bonatti, C.I.D.
StrataFLEX  Corporation
Tel.: +1.416.752.2224 xt.2232
Fax: +1.416.752.6719
Toll Free: +1.866.771.7765
E-mail: [log in to unmask]
Web: www.strataflex.com

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