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January 2006

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Subject:
From:
Burhan Capar <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Fri, 6 Jan 2006 16:16:12 -0500
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Hi Carol,

 

I did not see anybody posting a response to your question so I am

replying directly to you rather than to the forum

 

- If at all possible, do not use any vias in the cavity area

- If you have to use vias in the cavity areas, make sure they stop at

the exposed layer.  We recommend filling those vias, planarizing and

overplating with copper

- Will you be soldering or wire bonding a component in the cavity, or

is the cavity there just to house a component?  Depending on your answer

I can have more suggestions for you.

 

Best regards

 

 

 

 

Burhan Capar

Design / Layout Manager

Metro / Speedy Circuits

205 LaGrange Avenue

Rochester, NY 14613

Phone: 585-254-2980

E-fax: 585-486-1306

e-mail: [log in to unmask]





>>> [log in to unmask] 1/5/2006 5:43 PM >>>

Hi there,

I am working on my first cavity board design, and I need help! The

cavity is made by basically cutting a hole in the bottom layer. Do the

vias in the cavity need to be built as buried, or can they be standard

top to bottom?

Thanks in advance!

Carol



Carol Chapman, CID+ 

ECAD Designer, Sr. Analyst

Dell, Inc. 

One Dell Way 

Round Rock, TX 78682 

512.728.4494 

[log in to unmask] 







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