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Reply To: | (Designers Council Forum) |
Date: | Fri, 6 Jan 2006 16:16:12 -0500 |
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Hi Carol,
I did not see anybody posting a response to your question so I am
replying directly to you rather than to the forum
- If at all possible, do not use any vias in the cavity area
- If you have to use vias in the cavity areas, make sure they stop at
the exposed layer. We recommend filling those vias, planarizing and
overplating with copper
- Will you be soldering or wire bonding a component in the cavity, or
is the cavity there just to house a component? Depending on your answer
I can have more suggestions for you.
Best regards
Burhan Capar
Design / Layout Manager
Metro / Speedy Circuits
205 LaGrange Avenue
Rochester, NY 14613
Phone: 585-254-2980
E-fax: 585-486-1306
e-mail: [log in to unmask]
>>> [log in to unmask] 1/5/2006 5:43 PM >>>
Hi there,
I am working on my first cavity board design, and I need help! The
cavity is made by basically cutting a hole in the bottom layer. Do the
vias in the cavity need to be built as buried, or can they be standard
top to bottom?
Thanks in advance!
Carol
Carol Chapman, CID+
ECAD Designer, Sr. Analyst
Dell, Inc.
One Dell Way
Round Rock, TX 78682
512.728.4494
[log in to unmask]
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