Hi Richard!
Does 125 C. really damage components? How about the 48-hour time that's
listed in J-STD-033, do you think that's excessive?
I hate to bake components, but I do understand that there is risk from
absorbed moisture. But like you, I would like to do it at the lowest
temperature and the shortest time that's needed, and still ensure that
there will be no problems from absorbed moisture.
Kind regards,
-Steve Gregory-
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, January 24, 2006 10:38 AM
To: [log in to unmask]
Subject: Re: [TN] baking moisture sensitive components
As a general rule, bake at the lowest possible temperature whenever
possible.
I typically use 105 Deg. C., just above the boiling point.
The times and temperatures listed in J-STD-033 are guidelines, but I try
never to bake at 125 C, as listed. This has been found to damage some
components.
We use Associated Environmental Chambers for those situations where a
vacuum bake @ 1/2 atmosphere is required (per Mil Std), but actually
prefer to use a Blue M oven for baking without vacuum. Both ovens work
well.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Walker
Sent: Tuesday, January 24, 2006 10:12 AM
To: [log in to unmask]
Subject: [TN] baking moisture sensitive components
Hi All,
I have some questions concerning the baking of moisture sensitive
components.
Are there any general guidelines you follow regarding the amount of
time/temperature required to properly bake components or PCB assemblies
prior to component assembly or rework? I've seen articles speak of 12,
24 or 48 hour bakes at 125 C.
Also, can anyone recommend a small table top type oven to perform the
baking with? I've heard some people use a regular old toaster oven with
success, but I might be concerned about the temperature control
capability of such an oven. I work in a small PCB prototype environment
where the boards may be up to 14" x 10" in size. I might need to prep 1
or 2 PCB assemblies along with maybe 6 BGA's (40mm x 40mm) at a time
with the oven.
I'd greatly appreciate any recommendations or additional comments on the
subject.
Regards,
Bob Walker
[log in to unmask]
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