TECHNET Archives

January 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Mon, 23 Jan 2006 08:49:26 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (65 lines)
What is the change in thickness?

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 37 
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 
                           
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Friday, January 20, 2006 6:26 PM
To: [log in to unmask]
Subject: [TN] Laminate material

I am using a standard 0.62 thick laminate 6 layers. The board size is
1.375 by 2 inches. It is a lead free assembly and is a little unusual in
that it has BGA and QFP components on the top, but is mounted with 300+
bga balls on the reverse side, so in effect is actually a component when
finished.

I am making this out of Polyclad 370HR, and have no coplanarity issues
with the finished product.

I have a request though to make the product thinner for one customer
application.

Anyone have suggestions on a material that could be mechanically stable
enough to reduce the current board thickness in order to achieve this -
as I said it needs BGA flatness and is assembled at 260 C twice by us
(components and ball attach) and once by the customer.

Thanks in advance,

John

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2