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Date: | Mon, 23 Jan 2006 08:49:26 -0500 |
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What is the change in thickness?
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Friday, January 20, 2006 6:26 PM
To: [log in to unmask]
Subject: [TN] Laminate material
I am using a standard 0.62 thick laminate 6 layers. The board size is
1.375 by 2 inches. It is a lead free assembly and is a little unusual in
that it has BGA and QFP components on the top, but is mounted with 300+
bga balls on the reverse side, so in effect is actually a component when
finished.
I am making this out of Polyclad 370HR, and have no coplanarity issues
with the finished product.
I have a request though to make the product thinner for one customer
application.
Anyone have suggestions on a material that could be mechanically stable
enough to reduce the current board thickness in order to achieve this -
as I said it needs BGA flatness and is assembled at 260 C twice by us
(components and ball attach) and once by the customer.
Thanks in advance,
John
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