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Date: | Sat, 21 Jan 2006 13:02:06 -0500 |
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Ioan,
Probably late with the reply.
Get the boards routed to finished circuit size and deal with only the
assembly issues thereafter.
Other "break away" type singulation methods do not work well for these
boards. You will be placing stresses on components. You will find that you
will also be doing a lot of edge repairs unless you want to do the
"machining" after assembly with specialized equipment you can buy for this
task.
Post assembly routing is an option. I have heard of water-jet cutting as
well. Beware of stresses you will be placing on your components and
connectors as well as all the debris you will generate.
All these things puts the risk on you after you have added all the value
through assembly.
Good luck
Gerry
From: "Tempea, Ioan" <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Tempea,
Ioan" <[log in to unmask]>
To: [log in to unmask]
Subject: [TN] Panelization of backplanes
Date: Thu, 19 Jan 2006 15:37:58 -0500
Hi Technos,
I have a few 2.5"x18" PCBs here that are 0.236" thick. Among the pressfit
connectors there also are some SMT passives, so I need to pass them on the
assembly line.
Can I panelize boards of this thickness? Is V-scoring an option?
Thanks,
Ioan
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