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January 2006

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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Thu, 26 Jan 2006 07:24:23 -0600
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TechNet E-Mail Forum <[log in to unmask]>, "Stadem, Richard D." <[log in to unmask]>
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"Stadem, Richard D." <[log in to unmask]>
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Well, immersion silver is still cheaper than gold over nickel.
The cheapest alternative is OSP, but I would not recommend it. It
depends also on the type of assembly and its application.
Immersion tin may be an alternative, but I would not recommend that
either, as it has serious storage and long-term reliability issues.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Wednesday, January 25, 2006 7:38 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion Gold and LF PROCESS

Richard:  Thanks so much for the help.....much appreciated!!!!   My boss
is
now askiing me to look in other directions vs. SAC305, with the price
of silver skyrocketing.  Any suggestions?
As a contract manufacturer, we see a huge variety of applications, so I
am reluctant to go into something that the rest of the world has not
fully investigated.

Thanks for your help!!!!!

Best regards,
Bill

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