Sender: |
|
X-To: |
|
Date: |
Wed, 18 Jan 2006 14:38:49 -0600 |
Reply-To: |
|
Content-type: |
text/plain; charset=US-ASCII |
Subject: |
|
From: |
|
X-cc: |
|
In-Reply-To: |
|
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
Hi Neil! The real question you need to answer is "for the printed wiring
assemblies I plan to process, do have a large enough process window or do I
need to use an inert atmosphere (eg. N2) to increase the size of the
process window"? Many Pbfree soldering processes will be perfectly
adequate with air atmospheres in their process but folks with large pwas or
heavy thermal demand pwas will use N2 to improve the soldering process. But
that larger process window comes at a price - N2 isn't free. Inert
atmospheres are a choice, not a necessity. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
Neil Maloney
<nmaloney@CCONTRO
LS.COM> To
Sent by: TechNet [log in to unmask]
<[log in to unmask]> cc
Subject
01/18/2006 02:31 [TN] Time to fish or cut bait
PM
Please respond to
TechNet E-Mail
Forum
<[log in to unmask]>
; Please respond
to
Neil Maloney
<nmaloney@CCONTRO
LS.COM>
Greetings, Technet!
My company is making the transition from leaded to lead -free assembly
in the US (we have already converted our overseas facility) Now we are
in the throes of the N2 vs. air battle. Our overseas unit uses air
only without any problems (ENIG boards, 0602s to QFPs, no BGAs) In
the US we are looking to start designing BGA and flip-chip assemblies
with the same type ENIG and Entek boards. We are buying a new 10 zone
reflow oven, and battle begins. Do we start with nitrogen or not? Can a
small company make lead-free BGA assemblies without going to an N2
atmosphere?
Does air make the process window too small for BGA?
Our smallest PCB is about 8x12cm.
Thanks in advance
Neil Maloney, Manufacturing Engineer
Contemporary Control Systems, inc
2431 Curtiss St Downers Grove, IL 60515
(630) 963-7070 x132
[log in to unmask]
http://www.ccontrols.com <http://www.ccontrols.com/>
http://www.ctrlink.com <http://www.ctrlink.com/>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|