And they are silver bullets................8-)
To explain my rather brief answer earlier, I have put a few "bullet
points" below:
1 Poly clad 370HR currently undergoing destructive reflow cycling
passed 9 cycles of 260 C to the Jedec 20C specification, heading for 15
cycles. Test is to reflow 3 times and then test using ICT board level
node to node, net to net test plus visual examination for de-lamination.
Test will terminate when either the board level test fails or the boards
delaminate.
2 Silver immersion evaluated using BGA ball attach and shear
comparison with same coupon made from enig. Results are that the shear
force of the silver immersion finish is 2X that of the enig. Took this
to Dage and used their new 4000 series high speed tester. Results at 500
mm per second are that the enig samples all shear at the interface
(brittle fracture - bad) all of the silver immersion had indications of
pad pull off from the substrate during testing (good!)
John
John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Wednesday, January 18, 2006 11:26 AM
To: TechNet E-Mail Forum; John Burke
Subject: RE: [TN] RoHS board finish
Good words, John. I like "bullet-proof".
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, January 18, 2006 11:55 AM
To: [log in to unmask]
Subject: Re: [TN] RoHS board finish
Polyclad 370HR finished in immersion silver will be pretty much bullet
proof.
Kind regards,
John Burke
John
John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Walker
Sent: Wednesday, January 18, 2006 9:39 AM
To: [log in to unmask]
Subject: [TN] RoHS board finish
Hi All,
I'm doing my first PCB design that will use lead-free components and I
need to change my board finish from what I've always used.....HASL. I'm
looking for any recommendations or comments on the best board finish to
use.
The components used on the design will be a mixture of tin-lead and
lead-free (SAC), so I'm not sure if there is a preferred finish to use
in this type of situation. I work in a prototype environment where the
boards may be reworked (BGA removal/replaced) a number of times, so I'm
concerned about the ability of the finish being able to handle being
reworked/reflowed a number of times.
I'd also welcome any recommendations on the type of board material to
use since it will see an elevated temperature of up to 260C. I've always
just specified FR4 in the past.
Thanx in advance for any feedback.
Regards,
Bob Walker
[log in to unmask] (mailto:[log in to unmask])
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