Thanks. The adhesive meets NASA outgassing specification SP-R-0022 ( <
1.0% TML and < .10% CVCM)> The adhesive is DuPont acylic. No sulfur.
Regards Steve Kelly
Steve Kelly
PH: (416) 750-8433
FAX: (416) 750-0016
CELL: (416) 577-8433
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Tuesday, December 06, 2005 12:50 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion Silver question
Yes, watch the adhesive out gassing, it can wreck the solderability.
That is the reason that you cannot via plug silver boards - the
solderability is severely degraded due to the plug gasses during
adhesive cure.
John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
Sent: Tuesday, December 06, 2005 9:40 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Silver question
Steve
The heat alone should not cause a problem; at AT&T we baked immersion
silver boards at this temperature for a variety of reasons. What may be
of concern are the gases resulting from activating the bonding adhesive,
many of these contain sulfur which may tarnish the silver. I doubt,
however, it will cause an assembly problem.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: Steve Kelly<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Monday, December 05, 2005 3:26 PM
Subject: [TN] Immersion Silver question
Good Afternoon,
If we have to thermally bond a stiffener onto a flex circuit which has
a
thick (IPC- 4553) silver coating will it tarnish. The thermal cycle
will be approx. 360-370F for 1-1/2 hours under pressure. Thanks in
advance. Steve Kelly
Steve Kelly
PH: (416) 750-8433
FAX: (416) 750-0016
CELL: (416) 577-8433
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