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December 2005

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Subject:
From:
Baski Devre <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Baski Devre <[log in to unmask]>
Date:
Mon, 5 Dec 2005 18:41:59 +0200
Content-Type:
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text/plain (50 lines)
Dear Technetters

I look ovefr the IPC A-610 but I can not face with the quantity of nonwetting pads after assembly of the PCB.   
What are the acceptibility criteria of nonwetting PCB  for  a PCB which 
has about thousand pads both smd pads and through hole pads. Or, is there any standard which can state that after assembly 
how many  pads are tolerant to not being soldered per 1,000 pads.

Best Regards

-- 
Yusuf GÖMEÇ
Product Quality Engineer

BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey

Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
    00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
    00 90 216 4913269
Gsm: 00 90 533 6579897
    00 90 533 7480014 




-- 
Yusuf GÖMEÇ
Product Quality Engineer

BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey

Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
     00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
     00 90 216 4913269
Gsm: 00 90 533 6579897
     00 90 533 7480014 

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