United States Patent 4,646,128
Carson , et al. * February 24, 1987
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High-density electronic processing package--structure and fabrication
Abstract
A high-density electronic package module is disclosed which comprises a
stack of semiconductor chips having integrated circuitry on each chip. To
permit the emplacement of thin film circuitry on the access ends, each
access plane is etched to cut back the semiconductor material then covered
with passivation material, and thereafter lapped to uncover the ends of
electrical leads on the chips.
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Inventors: Carson; John C. (Corona del Mar, CA); Clark; Stewart A. (Irvine,
CA)
Assignee: Irvine Sensors Corporation (Costa Mesa, CA)
[*] Notice: The portion of the term of this patent subsequent to November
5, 2002 has been disclaimed.
Appl. No.: 720902
Filed: April 8, 1985
=========
MCM nowadays is not that low yield...mix-signal MCM plus memory and RF may
be low...
well, the cell phone is almost a one MCM now...It is a long way from
1985..jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Eric CHRISTISON
Sent: Friday, December 02, 2005 10:22 AM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] Moore's law and PWBs
Yes,
It was only 80% correct.
Good article though.
Problem with that stuff is the same as with multi chip modules. Lower yield
thus higher cost.
Regards,
Eric Christison
Mechanical Engineer
Home, Personal, Communication Sector - Imaging Division
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF
Tel: +44 (0)131 336 6165
Fax: +44 (0)131 336 6001
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Dixon
> Sent: Friday, December 02, 2005 2:53 PM
> To: [log in to unmask]
> Subject: Re: [TN] SV: [TN] Moore's law and PWBs
>
>
> No it's eetuk dot com
> Respectfully,
> Dave
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
> (KC/EMW)
> Sent: Friday, December 02, 2005 6:01 AM
> To: [log in to unmask]
> Subject: Re: SV: [TN] Moore's law and PWBs
>
> 100% yes /Inge
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Eric CHRISTISON
> Sent: den 2 december 2005 12:11
> To: [log in to unmask]
> Subject: Re: [TN] SV: [TN] Moore's law and PWBs
>
>
> Ingemar,
>
> My computer couldn't find eeuk.com.
>
> Is the address correct?
>
> Regards,
>
>
>
> Eric Christison
> Mechanical Engineer
> Home, Personal, Communication Sector - Imaging Division
> STMicroelectronics 33 Pinkhill Edinburgh EH12 7BF
>
> Tel: +44 (0)131 336 6165
> Fax: +44 (0)131 336 6001
>
>
>
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar
> Hernefjord
> > Sent: Friday, December 02, 2005 9:43 AM
> > To: [log in to unmask]
> > Subject: [TN] SV: [TN] Moore's law and PWBs
> >
> >
> > Forgot to tell that vertical communication between stacked wafers is
> > now a
> > reality:
> >
> > http://www.eetuk.com/tech/news/dev/OEG20030207S0034
> >
> > Inge
> >
>
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