I would suggest these are due to low pressure areas during the
lamination cycle. What is you cycle - bump, VAC, pressures, and are you
using any press-pads? Maybe post a picture on Steve site.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha
Sent: Wednesday, December 28, 2005 5:15 PM
To: [log in to unmask]
Subject: Re: [TN] (PCB fabrication) Lam Voids
They are in non-thermal areas.
Thank you,
Eddie Rocha
South Bay Circuits
Are the voids near the sidewalls of the circuit features or
are they
random in the non-thermal areas central to the resin mass.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie
Rocha
Sent: Wednesday, December 28, 2005 3:46 PM
To: [log in to unmask]
Subject: [TN] (PCB fabrication) Lam Voids
I'm getting "LAM VOIDS" on a 16 layer board that we build.
The board is .140" thick and has 2 oz copper on layers 2,
8, 9, and 15. Any ideas on what might be causing these "LAM
VOIDS". The "lam voids" are about .004" x .010" in size and
x-sections show them between different layers such as the
surface of layers 2, 6, and 11.
I just began looking into this issue so I'll appreciate any
ideas.
Thank you,
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