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December 2005

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Subject:
From:
paul reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, paul reid <[log in to unmask]>
Date:
Fri, 16 Dec 2005 13:53:44 -0500
Content-Type:
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text/plain (157 lines)
Unfortunately in college I was all science and had little time for the most
important subject, English.  I have come to enjoy, however, the right word
delivered at the right time.

Entitlement = a right to benefits that is granted.

I used entitlement because it was used in similar sense in a couple of
articles I read by Erik Bergum, Polyclad.  My intended meaning is that "as
received" thermal cycle results reflect the potential of the circuit board,
its' entitlement for reliability.  That entitlement is degraded by the
thermal excursions of tin-lead and lead-free assembly.  The entitlement for
me is the contribution of the base material and all process step including
copper quality, electroless quality, drilling, lamination, etc.  A robust
material offers a high entitlement, overly thick or thin electrolytic copper
detracts from that entitlement.  The entitlement is the sum total of all
contributions to the robustness the system we call a "printed wire board"
(PWB).  Not all contributors have equal influence and some combinations of
influence appear to have a synergy that greatly enhances the overall
entitlement of a PWB.

The hierarchy of influence in boards tested "as received" or after thermal
excursions to tin/lead temperatures (230C) is:

Primary - Copper quality (electrolytic and electroless)
Secondary  - Material
Tertiary - Hole quality, hole prep, non-functional pad, surface finish, etc.

The hierarchies of influences shift with the advent of lead-free thermal
excursions (260C):

Primary - Copper quality and material robustness compete for dominance
Secondary - Hole prep (interconnect quality is being tested, dielectric
thickness and hole size (read aspect ratio).
Tertiary - Hole quality, non-functional pad, three-point contact etc.
Spoiler - Delamination


Sincerely,

Paul Reid


Program Coordinator
PWB Interconnect Solutions Inc.

Tel:  613-596-4244 Ext. 229
Fax: 613-596-2200



-----Original Message-----
From: Valerie St.Cyr [mailto:[log in to unmask]]
Sent: Thursday, December 15, 2005 5:50 PM
To: [log in to unmask]
Subject: Re: [TN] Qualification of the Pb-free capable manufacturers


I like entitlement: it is the inherent properties in the material which
would permit it to be lead-free capable.
The material alone is not lead-free capable, because it must be fabricated
into a circuit board to be of any use.
Capable implies "already there" or "fit for use" of lead free; whereas
Entitlement implies "could be used", can claim fitness, but the
entitlement needs to be met with manufacturing
competence for there to be "capability"

... you say tomato I say tomatoe

MSN Encarta:

entitle (v)
synonyms: enable, allow, permit, authorize, sanction, warrant

entitlement (n)
synonyms: right, power, prerogative, title, privilege, claim

capability (n)
synonyms: competence, ability, skill, fitness, aptitude, proficiency,
competency, know-how, experience, expertise

capable (adj)
synonyms: able,competent, proficient, efficient, qualified, adept







Werner Engelmaier <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
12/15/2005 02:49 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
[log in to unmask]


To
[log in to unmask]
cc

Subject
Re: [TN] Qualification of the Pb-free capable manufacturers






Thanks Paul,
Great procedure.
I would suggest changing of "entitlement" to "capability" or "base line
performance" or some such--"entitlement" gives one the idea that something
is fully
expected.

Werner

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