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December 2005

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Subject:
From:
Chris Ball <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 15 Dec 2005 08:00:21 -0500
Content-Type:
text/plain
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text/plain (178 lines)
And anyway... it depends. Machine insert vs. hand insert and throw in
solder process. Quick and uncomplicated isn't easy when it depends and the
units are off by a factor of 10 or so.

-Chris




                       Bruce D Stilmack
                       <[log in to unmask]>               To:   [log in to unmask]
                       Sent by: TechNet                  cc:
                       <[log in to unmask]>                 Subject:    Re: [TN] FW: [TN] Component
                                                           Lead to Hole Clearance
                       12/14/2005 04:45 PM
                       Please respond to TechNet
                       E-Mail Forum; Please
                       respond to stilmack







I'm with Phil.  I've been trying to figure out the units

Bruce Stilmack
GDLS-TO Manufacturing Engineer
(850) 574-4773
[log in to unmask]



             "Crepeau, Phil
             (Space
             Technology)"                                               To
             <phil.crepeau@NGC         [log in to unmask]
             .COM>                                                      cc
             Sent by: TechNet
             <[log in to unmask]>                                     Subject
                                       Re: [TN] FW: [TN] Component Lead to
                                       Hole Clearance
             12/14/2005 04:32
             PM


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
              "Crepeau, Phil
                  (Space
               Technology)"
             <phil.crepeau@NGC
                   .COM>






maybe nobody believed your hole sizes and wire diameters (unless they
are in yards).

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Wednesday, December 14, 2005 1:24 PM
To: [log in to unmask]
Subject: [TN] FW: [TN] Component Lead to Hole Clearance

I did not get any responses the FIRST time perhaps the SECOND time is a
charm.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Tuesday, December 13, 2005 8:05 AM
To: [log in to unmask]
Subject: [TN] Component Lead to Hole Clearance

Fellow TechNetters:

Can someone shared their experience with calculating lead to hole ratio
as per IPC-2222 Figure 9-3?
I have a cross section in which I suspect the lead diameter cause
insufficient solder fillet.
I need a QUICK GUIDE to determine this relationship without being
complicated.

   Rough drill size:      0.000376
   Plated barrel size:   0.003432
   Lead size:              0.002047


Victor.


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