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Subject:	FW: [TN] Component Lead to Hole Clearance
From:	"Victor G. Hernandez" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Wed, 14 Dec 2005 15:23:53 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (55 lines)

I did not get any responses the FIRST time perhaps the SECOND time is a
charm.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Tuesday, December 13, 2005 8:05 AM
To: [log in to unmask]
Subject: [TN] Component Lead to Hole Clearance

Fellow TechNetters:

Can someone shared their experience with calculating lead to hole ratio
as per IPC-2222 Figure 9-3?
I have a cross section in which I suspect the lead diameter cause
insufficient solder fillet.
I need a QUICK GUIDE to determine this relationship without being
complicated.

   Rough drill size:      0.000376
   Plated barrel size:   0.003432
   Lead size:              0.002047


Victor.


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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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