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December 2005

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Subject:
SV: [TN] Qualification of the Pb-free capable manufacturers
From:
Ingemar Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord <[log in to unmask]>
Date:
Wed, 14 Dec 2005 17:22:03 +0100
Content-Type:
text/plain
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text/plain (59 lines) 
Werner,
UL's proposal about 288C for 10 seconds, is that a delamination coupon
test?
I follow your concerns with interest.
Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
Skickat: den 14 december 2005 03:06
Till: [log in to unmask]
Ämne: Re: [TN] Qualification of the Pb-free capable manufacturers

Hi Charlie & All,
Perhaps, somebody already has developed a "Lamination Coupon." ANYBODY?
Also, in response to some questions, the 'Soldering Temperature Impact
Index 
[STII]' is defined as follows

STII = {[Tg + Td]/2} - (% thermal expansion from 50 to 260°C)x10

I tried to weigh each of the parameters according to the way I perceive
their 
impact; Tg gives to the transition to the rubbery state with its huge
changes 
in properties; Td includes the temperature/time impact; and the thermal 
expansion the impact on the via loading.
An STII > 215 is a good number for LF-soldering.



Werner

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