I have an Analog Devices part, 56-lead Lead Frame Chip Scale Package LFCSP
with an 8X8mm body CP-56, supposed to be compliant with JEDEC MO-220-VLLD-2.

Having a tough time locating a recommended footprint for this one...
Any help?

Also any issues with mounting? Since this is a direct to board soldered
device, it may be subject to CTE mismatches and the like... anyone have
experience with any soldering or reliability issues with assembling this
part to a fiberglass/epoxy board?

Here's a link to the part description
http://www.analog.com/UploadedFiles/Packages/352655155839944545242119821CP_5
6.pdf
<http://www.analog.com/UploadedFiles/Packages/352655155839944545242119821CP_
56.pdf>

Best regards,


Bill Brooks

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------