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December 2005

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Subject:
From:
"Stadem, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:
Tue, 13 Dec 2005 12:44:20 -0600
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And Valerie, that was a lot of good input.
I just wish some sort of standard for pwb reliability could be agreed on
beforehand, to eliminate all of the lawsuits, etc.
No one is considering the fact that because some boards may be intended
for standard 63/37 solder processes, but contain BGAs with Pb-free
solder balls, the industry will need to increase the temp. somewhat, as
was described last week. But the circuit boards can barely withstand
current standard processes. Will they be able to withstand an increase
in process temperatures to accomodate the Pb-free BGAs, at around 230
deg. C? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, December 13, 2005 12:28 PM
To: [log in to unmask]
Subject: Re: [TN] Qualification of the Pb-free capable manufacturers

Hi Valerie,
AMEN to all of that---and PLEASE do not hold your breath waiting for
this to happen anytime soon.



Werner

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