TECHNET Archives

December 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 13 Dec 2005 11:10:40 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
Hi Susan,
The degree of cure is certainly a concern. I am pretty certain that the
laminates are fully cured--to what degree the prepreg layers are depends on a lot
of variables, but they are hardly ever cured to the same degree as the
laminates.
So my issue is not so much with the laminators, but with the resin suppliers
[sometimes of course, they are the same]. The resin/prepreg suppliers need to
give valid data for the materials they supplied, when they are fully cured.
The PWB fab houses need to make sure that their PWBs are in the laminating
presses long enough and at sufficient temperature to achieve the necessary levels
of cure--what it will take will vary with resin, glass-cloths style, lay-up,
etc.
As to your question: "when will a fabricator know that the board they make is
to be assembled in a LF process?"-- the answer is that his customer needs to
tell him. For LF-PWBs, the customer had better spec'ed the PWBs properly in
the procurement RFQ, in terms materials, plating thickness, drill hits, etc.
Unless this is done it will be quoted for SnPb-soldering capability, which for
higher end PWBs is inadequate for LF-soldering.

Werner

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2