For compliance of the materials to RoHS you would use IPC
1065............which is what that standard is for along with the JIG
substances.

For suitability for reflow process temperatures you would run trials
typically 6 + reflow excursions to 260 centigrade per Jedec 020C
profiles and THEN run through IST testing.

For the ability of the solderable finish to remain solderable through
your process flow you need to look at the individual process in order to
evaluate suitable finishes.

Hope this has helped more than confused.

You can call me off line if you need anything further.

Kind regards

John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Buetow
Sent: Friday, December 09, 2005 2:31 PM
To: [log in to unmask]
Subject: Re: [TN] Qualification of the Pb-free capable manufacturers

I am interested in this. I would think that any fab that offers a
HASL-alternative finish is "lead-free" capable. That would mean 99.9% of
the fabs out there could build a lead-free board. 
 
This does not, of course, account for the ability of laminate to hold
up, component solderability, etc. But lead-free is lead-free, right? Or
is the sentiment that "lead-free" means something much broader than "no
lead"? 
 
Mike
 
Mike Buetow
Editor in Chief
Circuits Assembly
30 Glenburnie Road
Boston, MA 02131 USA
W/mobile: 617-327-4702
 
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>>> [log in to unmask] 12/9/2005 4:19:50 PM >>>

Hi Technos,

IPC-1710A does not have anything specific for lead-free capability (or
at least I missed it). How do you qualify your PCB fabs?

Thanks,
Ioan

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