David,
Actually, these parts are from the vendor and we are rebumping per customer
request.
I share your concern and I am concerned about the vias on the PBGA
substrate. I read 'Via Life vs. Temperature Stress Analysis of Interconnect
Stress Test' and other articles about how high temp affects the vias in the
substrate.
Thank you for the warning, though :)
David
>From: "David D. Hillman" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
>[log in to unmask]
>To: [log in to unmask]
>Subject: Re: [TN] XFS analysis
>Date: Thu, 8 Dec 2005 16:47:19 -0600
>
>Hi David! If I understand you correctly, you are rebumping a BGA component
>that has SnPb solderspheres with SAC405 solderspheres. I highly recommend
>you proceed with caution as you are exposing a BGA component vendor
>qualified only for SnPb soldering processes to Pbfree soldering process
>temperatures (once for the rebumping procedure and once for the assembly
>procedure). You may induced component defects due to the higher temperature
>exposures.
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>
> David Tremmel
> <davidtremmel@HOT
> MAIL.COM> To
> Sent by: TechNet [log in to unmask]
> <[log in to unmask]> cc
>
> Subject
> 12/08/2005 04:28 Re: [TN] XFS analysis
> PM
>
>
> Please respond to
> TechNet E-Mail
> Forum
> <[log in to unmask]>
> ; Please respond
> to
> David Tremmel
> <davidtremmel@HOT
> MAIL.COM>
>
>
>
>
>
>
>Hello,
>
>I have a sample of standard-eutectic BGAs to reball with SAC405 solder
>spheres to evaluate if, among other things, the reballed BGAs will meet
>RoHS
>compliance. Our customer requested XRF analysis to verify this but if ye
>perveyors of the higher knowledge have better resouces than I to accomplish
>this then I be at thy disposal for suggestions.
>
>Also, if anyone has experience with lower temperature lead-free alloys, I
>would be interested in recommendations on that as well.
>
>
>Thank you in advance Technet,
>
>David
>
> >From: "Gervascio, Thomas" <[log in to unmask]>
> >Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
>"Gervascio,
> >Thomas" <[log in to unmask]>
> >To: [log in to unmask]
> >Subject: Re: [TN] XFS analysis
> >Date: Thu, 8 Dec 2005 17:05:52 -0500
> >
> >Is this like X Ray Fluorescence? In the case of XRF, if the solder
> >thickness is too thick, then the X ray from the underlying metalization
> >would be absorbed and not detected. I think about 1 to 2 mils would
> >probably be the limit but dependent upon the unit. A solder ball though
> >would probably be too thick to get anything other than the solder alloy
> >composition.
> >
> >Trace Labs is a good candidate. In the southeast US, Constellation Labs
> >(Largo FL- Constellation Technology Corporation 7887 Bryan Dairy Road,
> >Suite 100 Largo, FL 33777)
> >
> >Tom
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
> >Sent: Thursday, December 08, 2005 1:35 PM
> >To: [log in to unmask]
> >Subject: [TN] XFS analysis
> >
> >Technet,
> >
> >I have 20 BGAs which our client would like XFS analysis performed.
> >
> >Could someone point me in the general direction of a company in the US
>who
> >could perform this work?
> >
> >Thank you in advance,
> >
> >David
> >
> >_________________________________________________________________
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