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December 2005

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 8 Dec 2005 16:47:19 -0600
Content-Type:
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Hi David! If I understand you correctly, you are rebumping a BGA component
that has SnPb solderspheres with SAC405 solderspheres. I highly recommend
you proceed with caution as you are exposing a BGA component vendor
qualified only for SnPb soldering processes to Pbfree soldering process
temperatures (once for the rebumping procedure and once for the assembly
procedure). You may induced component defects due to the higher temperature
exposures.

Dave Hillman
Rockwell Collins
[log in to unmask]



                                                                       
             David Tremmel                                             
             <davidtremmel@HOT                                         
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                                                                   Subject
             12/08/2005 04:28          Re: [TN] XFS analysis           
             PM                                                        
                                                                       
                                                                       
             Please respond to                                         
              TechNet E-Mail                                           
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             ; Please respond                                          
                    to                                                 
               David Tremmel                                           
             <davidtremmel@HOT                                         
                 MAIL.COM>                                             
                                                                       
                                                                       




Hello,

I have a sample of standard-eutectic BGAs to reball with SAC405 solder
spheres to evaluate if, among other things, the reballed BGAs will meet
RoHS
compliance.  Our customer requested XRF analysis to verify this but if ye
perveyors of the higher knowledge have better resouces than I to accomplish
this then I be at thy disposal for suggestions.

Also, if anyone has experience with lower temperature lead-free alloys, I
would be interested in recommendations on that as well.


Thank you in advance Technet,

David

>From: "Gervascio, Thomas" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              "Gervascio,
>Thomas" <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] XFS analysis
>Date: Thu, 8 Dec 2005 17:05:52 -0500
>
>Is this like X Ray Fluorescence? In the case of XRF, if the solder
>thickness is too thick, then the X ray from the underlying metalization
>would be absorbed and not detected. I think about 1 to 2 mils would
>probably be the limit but dependent upon the unit. A solder ball though
>would probably be too thick to get anything other than the solder alloy
>composition.
>
>Trace Labs is a good candidate. In the southeast US, Constellation Labs
>(Largo FL- Constellation Technology Corporation 7887 Bryan Dairy Road,
>Suite 100 Largo, FL 33777)
>
>Tom
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
>Sent: Thursday, December 08, 2005 1:35 PM
>To: [log in to unmask]
>Subject: [TN] XFS analysis
>
>Technet,
>
>I have 20 BGAs which our client would like XFS analysis performed.
>
>Could someone point me in the general direction of a company in the US who
>could perform this work?
>
>Thank you in advance,
>
>David
>
>_________________________________________________________________
>Consigue aquí las mejores y mas recientes ofertas de trabajo EE.UU.
>http://latino.msn.com/empleos
>
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