TECHNET Archives

December 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Roach, David" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roach, David
Date:
Thu, 1 Dec 2005 11:00:09 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (114 lines)
I agree.  The time and temperature required to dry the chips in tubes would
be highly dependent on how much air can circulate through the tubes while
drying.  If the tubes are airtight, the chips would never dry out.

Dave Roach

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: Thursday, December 01, 2005 9:05 AM
To: [log in to unmask]
Subject: Re: [TN] moisture bake-out of ICs in tubes

Hello Graham,
    What are the package details (type, dimensions, pin count)?  I suggest
you use a service company to transfer the parts from the tubes to proper
Jedec trays and then bake them per recommended Jedec procedures.  The
relatively low cost for this service should more than offset the risk to
shortcut proper procedures.  All bets are off otherwise.


Best regards,
Leo

Leo M. Higgins III, Ph.D.
Vice President Technical Support Operations
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

ph     512-383-4593
fx      512-383-1590
[log in to unmask]
www.asat.com


The information contained in this electronic message is CUSTOMER/SUPPLIER
PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the
individual or entity named above. If the reader of this message is not the
intended recipient, you are hereby notified that any dissemination,
distribution and copying of this communication is strictly prohibited. If
you have received this communication in error, please immediately notify the
sender by electronic mail. Thank you.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Graham Collins
Sent: Thursday, December 01, 2005 8:04 AM
To: [log in to unmask]
Subject: [TN] moisture bake-out of ICs in tubes


Hello Technet!
I've got a pile of ICs received in tubes, that are MSL 3 and have been
exposed to ambient conditions.  Thus, the parts need to be baked out.
My question is this: if I want to bake them in the tubes (not take them
out of the tubes), what lowered temperature / longer time can I use?
The quantity means it would be very painful to take them out of the
tubes, and I know the tubes won't withstand 90C / 2 days, but the 40C /
28 days alternative per J-STD-033 (body <= 2mm, per table 4-1) is not
great either.  How can I calculate a happy medium between these two
time/temp combinations?

I do know this has come up on Technet before, but I can't find it in
the archive.

Thanks!

regards,

Graham Collins
Process Engineer,
L-3 Communications Electronic Systems Inc.
Halifax
(902) 873-2000 ext 6215

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2