We use std profile. BGAs are allowed to reflow 5 times,  and overheating
has never been a problem. Deviations from std routines use to be
dubious.
 
Inge
 
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Alan Kreplick
Skickat: den 7 december 2005 22:35
Till: [log in to unmask]
Ämne: [TN] BGA Rework Max temp & time above Liquidus
 

Hello Technetters: 

Quick survey/question: For BGA removal/replacement (SN63), what are
people using for max solder joint temperature and it's associated time
above liquidus. 

Copying the reflow profile guidelines?  I've previously went about 5-10C
less than the reflow profile guidelines to prevent overheating of the
part/case and to attempt to prevent any BGA's on the bottom-side from
re-reflowing, but now I'm second guessing myself. 

Thanks in advance.

 
Raytheon


Al Kreplick
Sr. Manufacturing Engineer
Land Combat/Precision Strike/Air to Air
978.470.9931
978.470.4307 fax
978-245-1702 pager
 <mailto:[log in to unmask]> [log in to unmask] 
 

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