Hi Victor! Both of the resources I listed are books and the ISBN is a
number that is universally useable to locate the books.
Dave
<Victor_G_Hernand
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To
12/14/2005 07:23 <[log in to unmask]>,
AM <[log in to unmask]>
cc
Subject
RE: [LF] oxidation of tin
Where could I acquire a copy of these two articles?
What is ISBN?
Victor,
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, December 13, 2005 5:34 PM
To: [log in to unmask]
Subject: Re: [LF] oxidation of tin
Hi Gordon and folks! Sorry for the tardy reply but I am only 400 emails
behind after being on business travel!
One reference that has a wealth of information on the oxidation of tin is
this book: The Mechanics of Solder Alloy Wetting & Spreading, ISBN
0-442-01752-9, Chapter 6, chapter author D. Morgan Tench. Portions of the
data presented in this chapter have been utilized by the JSTD-002 and
JSTD-003 specification committees. A second reference book would be: The
Electrodeposition of Tin and its Alloys, ISBN 3-87480-118-7, Author Dr.
Manfred Jordan. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Davy, Gordon"
<[log in to unmask]
COM> To
Sent by: Leadfree [log in to unmask]
<[log in to unmask] cc
>
Subject
Re: [LF] oxidation of tin
12/08/2005 07:43
AM
Please respond to
"(Leadfree
Electronics
Assembly Forum)"
<[log in to unmask]
>; Please respond
to
"Davy, Gordon"
<[log in to unmask]
COM>
Gerhard Haubner has asked about the thickness of oxides on tin. The place
to look for info on this, as for so many other topics, is _Soldering in
Electronics_, by R.J. Klein Wassink, now retired from Philips in Eindhoven.
The second edition, dated 1989 (Ayr, Scotland, Electrochemical
Publications, ISBN 0 901150 24 X) states on page 221 (I have omitted the
references):
Two oxides of tin are known, SnO and SnO2. In the oxidation of tin in air
below 200°C both play a part, although SnO is the main one. The tin-oxide
layers are transparent to light, thus producing only a slight
discoloration. Above 200°C, the thickness increases and interference
colours become visible... Fresh layers [of tin oxide] have a thickness of
about 1,5 nm and grow approximately logarithmically with time: 2 nm after a
week, 3 nm after a year, and only 6 nm after 20 years.
At about 200°C, the growth rate is approximately twice the rate at 100°C.
At 200°C after 24 hours, a layer of 30 nm is formed on the tin coating on
copper wires. Both water and water vapor enhance the growth of the layer
considerably, as is shown [in a table not reproduced in this posting] for
tin in boiling water.
The effect of lead (in solid solution in the tin) on the oxidation rate of
tin can be neglected. Antimony and bismuth assist oxidation, whilst
phosphorus, zinc and indium retard growth... The tin [in tin-lead alloys]
oxidizes preferentially, so that for solder alloys the main oxide is SnO,
just as for pure tin... [Elsewhere he documents that the dross on wave
solder pots containing tin-lead solder is mostly solder encapsulated with
tin oxide.]
Dave Hillman and Morgan Tench of Rockwell have studied the oxides of tin
using SERA (sequential electrochemical reduction analysis) technique, and
since Dave subscribes to this forum, I'm sure he will have info to add.
Gordon Davy
Baltimore, MD
[log in to unmask]
410-993-7399
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