Subject: | |
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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 14 Dec 2005 16:18:16 -0000 |
Content-Type: | text/plain |
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I recall they found that even when the ball did not reflow the joint was
good - copper, brass or steel does not melt when you solder to it yet
the joint is still good.
Regards,
Chris
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pratap Singh
Sent: 14 December 2005 16:13
To: [log in to unmask]
Subject: Re: [LF] Mixing SnPb and Pb free BGA's on an assembly
Chris,
NPL paper shows that mixed solders (LF mixed with SnPb) provide better
reliability than SnPb alone. This will happen when there is reflow of
both solders.
The question being asked, however, is different. Some folks want to
use a LF solder ball package in SnPb reflow profile. LF will not reflow
in 225 - 235 C range. Visually joint may look OK because SnPb has
reflowed covserin the pad and LF solder ball. LF solder ball, however,
has not reflowed. That produces a weak unreliable joint.
One may have to use rework type approach as shown by NPL data where
the reflow of LF solder ball is assured by using the right thermal
profile.
__________________________
pratap singh
tel./fax 512-255-6820
email:[log in to unmask]
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