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December 2005

Leadfree@IPC.ORG

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Subject:
From:
"James, Chris" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 14 Dec 2005 16:18:16 -0000
Content-Type:
text/plain
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text/plain (69 lines)
I recall they found that even when the ball did not reflow the joint was

good - copper, brass or steel does not melt when you solder to it yet

the joint is still good.



Regards,

Chris

 



-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pratap Singh

Sent: 14 December 2005 16:13

To: [log in to unmask]

Subject: Re: [LF] Mixing SnPb and Pb free BGA's on an assembly



Chris,

  NPL paper shows that mixed solders (LF mixed with SnPb) provide better

reliability than SnPb alone. This will happen when there is reflow of

both solders.



  The question being asked, however, is different. Some folks want to

use a LF solder ball package in SnPb reflow profile. LF will not reflow

in 225 - 235 C range. Visually joint may look OK because SnPb has

reflowed covserin the pad and LF solder ball. LF solder ball, however,

has not reflowed. That produces a weak unreliable joint.



  One may have to use rework type approach as shown by NPL data where

the reflow of LF solder ball is assured by using the right thermal

profile.



  __________________________





pratap singh

tel./fax 512-255-6820

email:[log in to unmask]



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