Good luck. We had much difficulty with reliability of the connections. The
silver solder balls did not fully reflow using SnPb process. Performed a
manual operation to install the BGA after normal SnPB process.

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of David Greig
Sent: Tuesday, December 13, 2005 9:30 AM
To: [log in to unmask]
Subject: [LF] Mixing SnPb and Pb free BGA's on an assembly


Is it possible to get an acceptable solder joint if a Pb free BGA is put
onto a board using SnPb solder paste and normal SnPb
profiles?
The lead free solder balls are SnAgCu 96.5/3/0.5.

Seems nigh impossible to get DDR2 packages with SnPb balls.

I'm designing a high end DSP into an industrial instrument. The DSP is not
available lead free, nor does the application call
for lead free (thankfully).
There is no option to use a different memory type with the DSP. Nor is there
any possibility of using a different DSP or FPGA
due to time/cost/sanity.
Don't want to explore going lead free on this one (for obvious reasons), and
certainly do not welcome the expense of reballing
0.8mm DDR2 chips.


Best Regards

David Greig
______________________________
GigaDyne Ltd
Buchan House
Carnegie Campus
Dunfermline KY11 8PL
United Kingdom
t: +44 (0)1383 624 975
www.gigadyne.co.uk <http://www.gigadyne.co.uk/>
______________________________


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