There has been a lot of discussion concerning mixing Tin Lead (SnPb) and
Lead-Free BGA's on an assembly. Courtesy of D. Hillman, Rockwell Collins,
his paper is on our Lead Free Soldering Website:
http://www.aciusa.org/leadfree/lead_papers.htm

Also, ACI hosted a Lead Free Soldering Summit this past July, concentrating
on high reliability aerospace applications. Many of you have expressed
interest in the presentations. The presentations are now on our Lead Free
Soldering website: http://www.aciusa.org/leadfree/lf_summit.html

Hope this helps.

Have a safe and joyous holiday season.

Later.

Lee Whiteman
Senior Manufacturing Engineer
American Competitiveness Institute
E-Mail: [log in to unmask]
Ph: (610) 362-1200 x208
Fax: (610) 362-1290

This message is for informational purposes only and does not supersede,
modify, or create any agreements with ACI. Information contained in this
message does not bind ACI or its affiliates to any commitment, either
express or implied, unless ratified in writing by an authorized
representative.

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