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Subject:	Re: wire tinning solder pots
From:	Roger Bilham <[log in to unmask]>
Reply To:	Roger Bilham <[log in to unmask]>
Date:	Tue, 20 Dec 2005 10:18:41 -0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (61 lines)

Phil & other LFers,

You may find that fine copper wires dissolve to an unacceptable extent in
SAC305. In this case, it is worth considering Sn92Cu6Ag2 or, to be more
economical, Sn92Cu8. As for the pot material, I would try to use cast iron,
which seems to resist dissolution by these high Sn alloys.

Best regards,
Roger Bilham

Falcon Metals UK
020 8249 7828
07941 122446

----- Original Message -----
From: "Phil Nutting" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, December 16, 2005 6:34 PM
Subject: [LF] wire tinning solder pots


Good afternoon,

Has anyone started to change over small solder pots used for wire
tinning from tin/lead to lead free?

What alloy and flux has you found to be best?

I'm planning to run SAC305 in my wave solder pot, so using the same
would be convenient, but not essential.

Using an RA or RMA flux probably would be best.

The primary function of these solder pots is for tinning Litz wire (many
fine strands of individually enamel coated wires) for inductors.

All suggestions are welcome.

Phil Nutting

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