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December 2005

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Thu, 15 Dec 2005 09:33:03 -0500
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Blair

This is a problem that occurs from time to time. It often can be alleviated by segmenting the ground plane.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389 
  ----- Original Message ----- 
  From: Blair K. Hogg<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Thursday, December 15, 2005 9:07 AM
  Subject: [TN] PCB warping due to copper imbalance


  We have a motherboard type PCB assembly that constantly warps during the wave soldering process. From what I've learned on this forum, I believe it is due to a copper imbalance from the top layer to the bottom layer - the PCB is a 2 layer assembly, with traces on the bottom and ground planes on the top. 

  My question is this - is it typical that the warping will occur towards the side with more copper (the side with more copper will be bowed inward)? 

  Thanks,

  Blair

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