We have a motherboard type PCB assembly that constantly warps during the wave soldering process. From what I've learned on this forum, I believe it is due to a copper imbalance from the top layer to the bottom layer - the PCB is a 2 layer assembly, with traces on the bottom and ground planes on the top. 

My question is this - is it typical that the warping will occur towards the side with more copper (the side with more copper will be bowed inward)? 

Thanks,

Blair

*******************************************************************
This email and any files transmitted with it are confidential and
intended solely for the use of the individual or entity to whom they
are addressed. If you have received this email in error please notify
the system manager.

This footnote also confirms that this email message has been swept
for the presence of computer viruses.

www.hubbell.com - Hubbell Incorporated

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------