Hi Charlie & All,
Perhaps, somebody already has developed a "Lamination Coupon." ANYBODY?
Also, in response to some questions, the 'Soldering Temperature Impact Index
[STII]' is defined as follows
STII = {[Tg + Td]/2} - (% thermal expansion from 50 to 260°C)x10
I tried to weigh each of the parameters according to the way I perceive their
impact; Tg gives to the transition to the rubbery state with its huge changes
in properties; Td includes the temperature/time impact; and the thermal
expansion the impact on the via loading.
An STII > 215 is a good number for LF-soldering.
Werner
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