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November 2005

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Subject:
From:
"Linda.Li" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Linda.Li
Date:
Mon, 7 Nov 2005 16:27:35 +0800
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text/plain
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text/plain (28 lines)
Dear all,

Recently we met a quality problem after gold wire bonding, we found nickel exposed around the gold wire wedge on the circuit board, however we don't know if this problem will affect the circuit board reliability.  I would like to know your opinions.   The surface finish of the circuit board is Electrolytic Nickel and Gold plating.  Your comments are highly appreciated!!

BTW, Is there any inspection specification for wire bonding?


Best regards,

Linda Li




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