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Date: | Fri, 4 Nov 2005 11:01:13 -0500 |
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Hi Tom:
It has been a while since you been heard in this
forum? Alumina has a melting point of more than 2000 deg C, so there is
no worries about the board itself. Using a Mole I would develop a
profile that ensure all the component's leads reflow to the pads.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gervascio, Thomas
Sent: Thursday, November 03, 2005 3:59 PM
To: [log in to unmask]
Subject: [TN] alumina PCB substrates
Are there any guidelines for developing SMT reflow profiles for
components mounted on alumina substrates? I've been search the net but
haven't found anything.
Thanks
Tom Gervascio
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