Developing profiles for alumina substrates is not substantially different
Some tips
- Alumina has a high thermal conductivity, less delta T, can shorten
profile.
- Solderability of thick film traces may not be as high as PCB, may need
different time over liquidus.
- Joints may look a little more dull or frosted due to use of Sn62 and high
Ag in circuitry. Especially if prolonged cool down. Just alert inspection.
- Some people run into trouble using inappropriate jigging when processing
small/irregular shaped substrates. Avoid jigs designs/material which are
heat soaks or masks compared to small parts.
- Alumina is an abrasive, it wears everything out faster than FR4.



Regards

Mike Fenner
Indium Corporation

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gervascio, Thomas
Sent: 03 November 2005 20:59
To: [log in to unmask]
Subject: [TN] alumina PCB substrates

Are there any guidelines for developing SMT reflow profiles for components
mounted on alumina substrates? I've been search the net but haven't found
anything.

Thanks
Tom Gervascio


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