Thanks Leo and Ramon,
Your assistance is appreciated.
Jeff
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Tuesday, 29 November 2005 12:58 AM
To: [log in to unmask]
Subject: Re: [TN] Unusual soldering challenge
Hi Jeff:
I have not soldered a component like you are trying to solder,
thanks for sending me the drawing of the component. It is very unique. I
have solder pipes many times. We flux the heck of the inside of the pipe
and the outside of the mating pipe and insert them, heat them and at
the same time feed solder to the joint. The flux bubbles to the outside
of the joint. Meaning, part of it to the environment and part to the
inner pipe environment but away from the pipes contacting surfaces. I
have proven it by reheating the joint and pulling the pipes away from
each other and seeing that both pipes are fully wetted and no signs of
flux. Flux will form around BGA balls or PGA pins, but if it is a
continuous joint such as this component's the flux should bubble out of
it given the right profile.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeff Brown
Sent: Thursday, November 24, 2005 12:39 AM
To: [log in to unmask]
Subject: Re: [TN] Unusual soldering challenge
Hi Zil,
Unfortunately it's too late to revise the board this time, but I will
pass your suggestion on for next time.
Many thanks,
Jeff
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Zilber Gil
Sent: Wednesday, 23 November 2005 11:01 PM
To: [log in to unmask]
Subject: Re: [TN] Unusual soldering challenge
Hello Jeff,
We had similar components short time ago, and we create a grid in the
aperture of the stencil, similar to what Ivan suggested. The reflow pass
well, but after examine the component with X-ray we saw air trapped in
the solder (about 20% of the area). Thus, I suggest designing the pad on
the PCB the same way as the grid in the stencil.
Regards,
Gil Zilber
Technologist, Elta system Ltd.
Tel. +972-8-8577240
Mobile +972-54-4983222
http://www.iai.co.il/site/en/iai.asp?pi=17887
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeff Brown
Sent: Tuesday, November 22, 2005 7:46 AM
To: [log in to unmask]
Subject: [TN] Unusual soldering challenge
Hi Everyone,
We have a problem with a fairly unique component that requires soldering
to a PCB. I'm really hoping that someone has seen this before as it
looking really awkward.
The component is mounted on a piece of fiberglass about 25mm x 16mm. The
footprint consists of a ground pad which takes up 95% of the area, and
four signal pads with 0.5mm clearance from the ground pad.
The manufacturer recommends a grid of stenciled paste for the ground pad
due to the large area, but we are concerned that if the paste melts from
the outside edges in, then it will at a minimum result in flux
entrapment, and at worst, the trapped flux will boil and lift the
component, or move the molten solder causing shorts to the signal pads.
I imagine that even if we used solid paste pattern that this would
probably only make the problem worse.
Or are we just being overly pessimistic?
Any thoughts on options would be gratefully received... Currently
wondering about the possibility of applying BGA balls to the package so
that there is some clearance between the board and the component.
If anyone is interested, I can send the component datasheet to them
directly.
Thank you all in advance
Jeff Brown and Josh Vear
EOS Space Systems
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
This message is processed by the PrivaWall Email Security Server.
The information contained in this communication is proprietary to
Israel Aircraft Industries Ltd.
and/or third parties, may contain confidential or privileged
information, and is intended only for the use of the intended addressee
thereof. If you are not the intended addressee, please be aware that any
use, disclosure, distribution and/or copying of this communication is
strictly prohibited.
If you receive this communication in error, please notify the sender
immediately and delete it from your computer. Thank you.
This message is processed by the PrivaWall Email Security Server.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
